Kishore K. Chakravorty - San Jose CA,
Johanna Swan - Scottsdale AZ,
Brandon C. Barnett - Beaverton OR,
Joseph F. Ahadian - Carlsbad CA,
Thomas P. Thomas - Beaverton OR,
Ian Young - Portland OR,
Intel Corporation - Santa Clara CA
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.